Semiconductor Packaging: Materials Interaction and Reliability by Andrea Chen, Randy Hsiao-Yu Lo

Semiconductor Packaging: Materials Interaction and Reliability



Download Semiconductor Packaging: Materials Interaction and Reliability




Semiconductor Packaging: Materials Interaction and Reliability Andrea Chen, Randy Hsiao-Yu Lo
Language: English
Page: 207
Format: pdf
ISBN: 1439862052, 9781439862070
Publisher: CRC Press

—Dan Beaulieu, D.B. Management Group, in I-Connect007, December 2011

—Kevin K.L. Chen, Qualcomm Atheros, San Jose, California, USA

—Zemo Yang, Ambarella Corp, Santa Clara, California, USA

—Daniel P. Tracy, SEMI, San Jose, California, USA

—Jack Belani, Vice President, Marketing and Sales, Contact Materials Division, Heraeus Materials Technology LLC

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